| Connection Form: | Wafer |
|---|---|
| Structure: | Three-Eccentric Sealing |
| Seal Form: | Supercharging Pressured Sealed |
| Work Pressure: | Mid-Pressure (2.5mpa< Pn <6.4mpa) |
| Working Temperature: | Medium Temperature (120°C<T<450°C) |
| Material of Seal Surface: | Soft Sealed |
| Customization: |
|---|
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