Connection Form: | Wafer |
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Structure: | Double-Eccentric Sealing |
Seal Form: | Supercharging Pressured Sealed |
Work Pressure: | High Pressure (10.0mpa< Pn <80.0mpa) |
Working Temperature: | Medium Temperature (120°C<T<450°C) |
Material of Seal Surface: | Metal Hard Sealed |
Customization: |
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